Sov. electrochemistry 26 No1 (1990) 36-40

A Possible Mechanism For The Increase in Limiting Current of Copper Electrodeposition From Nitrate Solutions

A. V. Sokirko and Yu. I. Kharkats

The mutual influence of Copper ion (Cu2+) deposition and N03- ion reduction was analyzed theoretically while allowing for the possible formation of Cu(OH)2. The influence of H+ ion concentration on the rate of Cu(OH)2 deposition was investigated.