Sov. electrochemistry 26 N^o1 (1990) 36-40

A Possible Mechanism For The Increase in Limiting Current of Copper Electrodeposition From Nitrate Solutions

A. V. Sokirko and Yu. I. Kharkats

The mutual influence of Copper ion (Cu²+) deposition and N0₃^- ion reduction was analyzed theoretically while allowing for the possible formation of Cu(OH)₂. The influence of H⁺ ion concentration on the rate of Cu(OH)₂ deposition was investigated.

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